Datacon 2200 Evo Manual Pdf Kenya (FAST | SUMMARY)
Datacon 2200 evo is a high-accuracy, multi-chip die bonder engineered by
(BE Semiconductor Industries) for high-precision electronics manufacturing. It is widely used for die attach and flip-chip applications, offering a placement accuracy of up to in its advanced configurations. Key Technical Specifications
The Datacon 2200 evo is designed for maximum production flexibility on a single platform:
Standard high-accuracy multi-chip die bonding, with advanced models reaching ±3µm @ 3 Sigma Supports up to 12-inch wafer handling Features an automatic tool changer
and integrated dispenser to handle various process steps without manual intervention. Versatility: Capable of handling Multi Module Attach
, asphalting different technologies on one tried-and-tested platform. Operational Resources & Manuals For technical staff or procurement in
looking for documentation, several specialized manuals exist: Product Overview:
A comprehensive summary of features, including its thermal compensation algorithms and new camera systems for long-term stability, can be found on Besi's Official Product Page SECS/GEM Interface Manual:
Essential for factory automation, detailing communication protocols between the equipment and host computer (e.g., SECS-I, HSMS, and GEM standards). User Guides:
Detailed technical brochures and catalogs (typically 2–4 pages) outlining specific operational capabilities are hosted on platforms like DirectIndustry Acquisition in Kenya datacon 2200 evo manual pdf kenya
While Besi operates globally, regional support for high-end semiconductor equipment in East Africa typically involves international distributors or direct contact with Besi’s European or Asian headquarters. PDF Access:
Manuals are often restricted to registered customers; however, technical overviews and interface documentation are frequently archived on academic and industrial PDF repositories. or a direct contact for a quote for this equipment in the East African region? Datacon 2200 evo - Product details | Besi
The Datacon 2200 evo is a high-speed, flexible multi-chip module assembly machine produced by Besi (BE Semiconductor Industries). It is primarily used for die attach and flip chip processes in semiconductor manufacturing. Key Specifications & Features
Accuracy: Placement accuracy of 10 μm (standard), with the "Advanced" model reaching 3 μm. Speed: Capable of throughput up to 7,000 units per hour.
Flexibility: Handles multi-chip modules, system-in-package (SiP) devices, and thin die assembly (down to 30 μm thick).
Tooling: Features an automatic tool changer with up to 7 (optionally 14) pick-and-place tools.
Dispensing: Integrated options for pressure/time (Musashi®), Auger, and Jetter type dispensers for various epoxy viscosities. Obtaining the Manual in Kenya
Direct public "manual PDF" links for industrial equipment like Besi machines are rarely available for open download due to proprietary software and safety regulations. To obtain the official manual or technical support in Kenya:
Manufacturer Portal: Access the Besi Customer Portal (requires login/registration) for official documentation and technical specifications. Datacon 2200 evo is a high-accuracy, multi-chip die
Regional Support: Contact Besi’s global support channels. While they may not have a dedicated office in Nairobi, they typically handle East African inquiries through their European (Netherlands/Austria) or Asian service hubs.
Local Distributors: Check with high-tech industrial equipment suppliers in Kenya that specialize in SMT (Surface Mount Technology) or semiconductor assembly. Machine Variants
2200 evo: The standard flexible platform for die attach and flip chip.
2200 evoplus: Enhanced version with improved camera systems, thermal compensation, and higher bonding accuracy. 2200 evo hS: High-speed variant optimized for throughput. Datacon 2200 evo - Product details | Besi
While there is no single public "Datacon 2200 EVO Manual PDF" specifically tailored for Kenya, the original technical documentation and operation manuals from the manufacturer, Besi, are available through their official customer portal or professional document repositories. Official Documentation Access
The most reliable way to obtain the full text and technical manual is through the Besi Customer Area.
Customer Area: Access to detailed machine catalogs and technical manuals typically requires a personal login and password assigned by Besi Customer Support.
Besi Webshop: Technical documents and 2D/3D images for machines manufactured after 2020 are hosted here for registered users. Available Technical Resources (Online)
If you do not have official login credentials, several portions of the manual and technical specifications are hosted on professional sharing platforms: Deep recommendation for Kenyan users: Strengths:
SECS/GEM Manual: A 153-page comprehensive manual for the SECS/GEM 6.2 interface on the Datacon 2200 platform is available on Scribd.
Product Brochures & Data Sheets: High-level technical overviews for various models (Evo Advanced, Evo Plus, Evo hF) can be downloaded directly from the Besi Product Details page.
Features Overview: A detailed summary of machine highlights, bond head features, and dispensing systems is hosted on Scribd. Core Technical Specifications
The standard Datacon 2200 EVO platform generally includes the following specifications: Placement Accuracy: From ±10plus or minus 10 ±3plus or minus 3 for the "Advanced" model. Bond Force: Programmable from N on specialized hF models). Bond Temperature: Maximum substrate temperature of 350∘C350 raised to the composed with power cap C and bond head temperature of 450∘C450 raised to the composed with power cap C
Throughput: Up to 7,000 Units Per Hour (UPH) for die attach. Wafer Size: Supports 2" to 12" wafers (50 mm – 300 mm). Datacon 2200 evo advanced - Product details | Besi
Downloads. Datacon 2200 evo advanced - brochure 2023.pdf. PDF - 4 MB. Datacon 2200 evo advanced - Product details | Besi
Deep recommendation for Kenyan users:
Strengths:
Weaknesses:
Beware of websites offering a "free Datacon 2200 EVO manual PDF" via download gates or sketchy links. Many are:
Always scan downloaded PDFs with a modern antivirus and verify the document’s revision date (look for "Rev 3.0" or later).